Planing Machine

Cleveland GAPU-5

Year of construction: 2010, condition: used, Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package). Accessories: Total enclosure, Camera system, image field 20 x 16 mm Extraction system 4000/3 D 240 3kW 630 m³/h Swivel unit for package dressing Software for converting DXF files to CNC files on PC Nljdpfx Aey Tl Iaemuec Touchscreen Standard software for straight, bevel or radii etc. DXF files. Single Diamond- / CBN grinding wheel diameter: 400 mm Single-disc width: 30 mm Packages: packages to Ø 150 mm and width 150 mm Swivel axis: swivel plate for swivel angle: +/- 95 degrees Delivery axis travel: 82 mm Oscillation hub : 83 mm Spindle mounting diameter: 60 mm DIA/CBN wheel flange hole: 32 mm Speed of silicon wafer: 700 - 2800 rpm SIC Grinding Spindle: 60 mm Ø Workpiece clamping X-axis travel: 185 mm Y-axis travel: 194 mm Workpiece spindle head holder diameter : 100 mm with belt spindle diameter : 100 x 200 mm Grinding wheel balance: max. 40 kg Workpiece spindle speed: 500 - 1500 rpm SIC discs up to max.: 200 x 20 mm x 32 mm Connected load: approx. 2.5 kW (400 Volts / 50 Hz) Dimensions W x D x H: 2000 x 2000 x 2600 mm weight: 1200 kg colour: red RAL 3003 / grey RAL 7035

Year of construction: 2017, condition: used, Suitable for dressing and profiling diamond and CBN grinding wheels using silicon carbide wheels (individually or in a package). Accessories: Total enclosure, Camera system with 7x motorized zoom video system, plus 10x digital zoom, image field 25 x 20 mm Nlodpfoy Ia Svjx Amusc Extraction system 4000/3 D 240 3kW 630 m³/h Swivel unit for package dressing Grinding wheel guard, swivels to the rear Software for converting DXF files to CNC files on PC Touchscreen Standard software for straight, bevel or radii. Single Diamond- / CBN grinding wheel diameter: 400 mm Single-disc width: 30 mm Packages: packages to Ø 150 mm and width 150 mm Swivel axis: swivel plate for swivel angle: +/- 95 degrees Delivery axis travel: 82 mm Oscillation hub : 83 mm Spindle mounting diameter: 60 mm DIA/CBN wheel flange hole: 32 mm Speed of silicon wafer: 700 - 2800 rpm SIC Grinding Spindle: 60 mm Ø Workpiece clamping X-axis travel: 185 mm Y-axis travel: 194 mm Workpiece spindle head holder diameter : 100 mm with belt spindle diameter : 100 x 200 mm Grinding wheel balance: max. 40 kg Workpiece spindle speed: 500 - 1500 rpm SIC discs up to max.: 200 x 20 mm x 32 mm Connected load: approx. 2.5 kW (400 Volts / 50 Hz) Dimensions W x D x H: 2700 x 2200 x 2200 mm weight: 1900 kg colour: red RAL 3003 / grey RAL 7035