REFLOW OVEN

SEHO GoReflow 1.8

Year of construction: 2011, condition: good (used), Type: Reflow soldering oven for PCB assembly (convection reflow). Manufacturer: SEHO Systems GmbH. Model: GoReflow 1.8. Application: Soldering process using full convection heat for small to medium-sized batches. Heating and Process Zones Number of heating zones: 5 zones (via convection). Length of heated zone: approx. 1850 mm. Maximum PCB width: approx. 410 mm. Number of cooling zones: 2 zones with active ventilation. Average transport/conveyor speed: approx. 0.40 – 0.55 m/min. Fpsdpoyl Utbofx Afzef Machine Structure and Dimensions Total length: approx. 3200 mm. Width: approx. 1250 mm. Height: approx. 1600 mm. Control and Functions Operation: Touch display or microprocessor-controlled interface (depending on configuration). Flux management: Filter and collection system for solder flux residues. Safety features: Emergency stop button and visual status indicators (signal lamp). Inline integration: Options for connection to SMT production lines via interfaces (optional).