Bond Alignment SystemEVB
        620 NT    
 Bond Alignment System
EVB
        620 NT    
                        Bidding                    
                                            €85,000                                    
                Year of construction            
                2022            
            Condition        
            Used                    
            Location        
                                                Suhl                                            

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Machine data
- Machine type:
- Bond Alignment System
- Manufacturer:
- EVB
- Model:
- 620 NT
- Machine number:
- S220193
- Year of construction:
- 2022
- Condition:
- used
Price & Location
- Price:
- €85,000
- Auction start:
- 21.10.2025 at 11:00 o'clock
- Auction end:
- 26.11.2025 at 11:15 o'clock
- Location:
-             Am Mittelrain 11, 98529 Suhl                 
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Details about the offer
- Listing ID:
- A203-56320
- Reference number:
- 376/3
- Update:
- 23.10.2025
Description
        Wafer alignment system, max. wafer size 150 mm, max. wafer thickness 4.4 mm, with optical alignment module, underside microscope and CCD camera, as well as rack unit. NOTE: The system is in like-new condition and has not yet been used in production!
Rodpexqiiaefx Ag Hsch
The listing was translated automatically. Translation errors are possible.
Rodpexqiiaefx Ag Hsch
The listing was translated automatically. Translation errors are possible.
Seller
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