Assembling machineDatacon 2200 evo gen 3
2200 evo
Machine data
- Machine type:
- Assembling machine
- Manufacturer:
- Datacon 2200 evo gen 3
- Model:
- 2200 evo
- Year of construction:
- 2017
- Condition:
- excellent (used)
- Functionality:
- fully functional
Price & Location
- Location:
- De Schutterij 15, 3905 PJ Veenendaal, Nederland
Details about the offer
- Listing ID:
- A219-52498
- Update:
- 26.08.2026
Description
The die bonder / multi-chip assembly machine from Datacon (Besi).
Die attach, multi-chip, and flip-chip capabilities.
Placement accuracy: ±10 µm at 3σ
Theta: ±0.15° at 3σ
Bond force: 0.5–75 N
Up to 4 working heads
Wafer handling up to 12 inches
Die attach up to approximately 7,000 UPH/module
Flip-chip up to 2,500 UPH with dipping
Heated bond head up to 450 °C
Ndedpfsy S S Uwjx Alfja
Substrate area up to 325 × 200 mm
Weight approximately 1,300 kg
The listing was translated automatically. Translation errors are possible.
Seller
Registered since: 2013
20 listings online
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